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- USA
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Ships within 48 hours · Estimated delivery Aug 24 - Aug 29
Reserve from the case
Ships within 48 hours · Estimated delivery Aug 24 - Aug 29
1 Gen 2 Type-C
08 Input current (a) 0
presentations
Compatibility Intel 500 Series
Mini tower with high extensibility that supports up to three 3
AMD Ryzen™ 9 7900X Marque_Microsoft 1 Gen 2 Type-CAMD Ryzen 9 7900X Architecture Zen 4 # of CPU Cores 12 Multithreading (SMT) Yes # of Threads 24 Max. Boost Clock Up to 5. 6GHz Base Clock 4. 7GHz L1 Cache 768KB L2 Cache 12MB L3 Cache 64MB Default TDP 170W Processor Technology for CPU Cores TSMC 5nm FinFET Processor Technology for I O Die TSMC 6nm FinFET CPU Compute Die (CCD) Size 71mm I O Die (IOD) Size 122mm Package Die Count 3 Unlocked for Overclocking Yes AMD EXPO Memory Overclocking Technology
US$ 26.00
US$ 38.50
US$ 33.50
US$ 46.00
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